SMT is a surface assembly technology. At this stage, the electronics assembly industry is a relatively popular technology. SMT chip processing mainly refers to the placement of components on the PCB printed with glue or solder paste through the placement equipment, and then through the soldering furnace. SMT chip processing has been recognized by manufacturers for its advantages such as high assembly density, small size of electronic products, and good high-frequency characteristics, because the working efficiency and stable performance of SMT chip placement machines have brought great advantages to our production. SMT placement machine can greatly improve production efficiency and provide high-quality products to customers. The SMT placement machine is equivalent to a placement robot, which is a relatively sophisticated automated production equipment. Next, let's learn about the SMT placement processing requirements and operation precautions.

1. SMD RC components can be tinned on a solder joint first, and then one end of the component is placed, and the component is clamped with tweezers. After soldering one end, check whether it is placed correctly. If it has been placed, you can solder the other end. One end.

2. Before soldering, apply flux to the pad and process it with a soldering iron to avoid poor tin plating or oxidation of the pad, resulting in poor soldering, and the chip generally does not need to be processed.

3. When starting to solder all the pins, add solder to the tip of the soldering iron, and apply flux to all the pins to keep the pins moist. Touch the end of each pin of the chip with the tip of a soldering iron until you see the solder flowing into the pin. When soldering, keep the tip of the soldering iron parallel to the soldered pin to prevent overlap due to excessive soldering.

4. Use tweezers to carefully place the PQFP chip on the PCB board. Be careful not to damage the pins and align them with the pads. Make sure that the chip is placed in the correct direction.

5. After soldering all the pins, wet all the pins with flux to clean the solder.