SMT chip processing qualification rate and high-reliability quality goals require control of printed circuit board design schemes, components, materials, processes, equipment, and regulations. Among them, alert-based process control is particularly important in SMT patch processing and manufacturing. At each step of the patch processing and manufacturing process, reasonable inspection methods must be followed to avoid various defects and hidden dangers before entering the next process.

       The popular explanation of SMT patch processing is: attach capacitors or resistors on electronic products with a dedicated machine, and weld them to make them stronger and not easy to fall to the ground. For example, the high-tech products we often use nowadays are computers and mobile phones. The internal motherboards are densely arranged with tiny capacitors and resistors. These capacitors and resistors are pasted using SMT patch processing technology and processed by high-tech patches. The capacitor resistance is much faster than manual patching, and it is not easy to make mistakes.

       The quality inspection of SMT patch includes incoming material inspection, process inspection and surface assembly board inspection. The quality problems found in the process inspection can be corrected according to the rework situation. The rework cost of unqualified products found in incoming inspection, solder paste printing and pre-soldering training is relatively low, and the impact on the reliability of electronic products is relatively small. But the rework of unqualified products after welding is completely different. Because post-soldering repair requires re-soldering after desoldering, in addition to working time and materials, components and circuit boards will also be damaged. According to the defect analysis, the quality inspection process of SMT patch processing can reduce the defect rate and scrap rate, reduce the cost of rework and repair, and avoid the occurrence of quality hazards from the source.

       SMD processing and welding inspection are comprehensive inspections of welded products. Generally, the points that need to be tested are: check whether the spot welding surface is smooth, whether there are holes, holes, etc.; whether the spot welding is crescent-shaped, whether there is more tin or less tin, whether there are tombs, bridges, parts moving, missing parts, tin beads And other defects. Whether each component has different levels of defects; search for short-circuit, conduction and other defects during soldering, and check the color change on the surface of the printed circuit board.

       In the SMT patch process, to ensure the soldering quality of the printed circuit board, it is necessary to always pay attention to whether the reflow soldering process parameters are reasonable. If there is a problem with the parameter setting, the soldering quality of the printed circuit board cannot be guaranteed. Therefore, under normal circumstances, the furnace temperature must be tested twice a day and the low temperature test once. Only by continuously improving the temperature curve of the welding product and setting the temperature curve of the welding product, the ability to guarantee the quality of the processed product.